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                内容标题19:Semiconductor Assembly and Packaging Services, Ayutthaya Thailan?d - Hana Group

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                            Semiconductor facility-Ayutthaya

                            SEMICONDUCTOR PACKAGING AND ASSEMBLY


                            Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC’s. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding etc.) and test solutions. Our “leadless” package size starts from a 2 pin 0.6 x 0.3 mm to our popular package size of 40 pin 12x12 mm. Our leaded packages starts from our SOT963 with foot print of 1x1 mm to standard 24L SOIC.


                            Besides standard packages, we also work with our customers closely to design and develop custom package solutions to address their specific needs. We provide custom package solutions for the MEMS, SENSORS, SIP (System in Package) and Hybrids/SMT, Multi-chip Modules, Isolation/Optocouplers, RFID/HOA, Optoelectronics and Clear Optical packages. Total installed capacity within Hana for IC packaging is ~ 20 million units per day and 80% of this is tested at Hana.


                            HANA Semiconductor (Ayutthaya) Co.,Ltd. Is ISO 9001, IATF 16949, ISO 14001, OHSAS 18001, ANSI/ESD S20.20 certified. The products are RoHS compliance.


                            Coupled with on-going training programs initiated to enhance technical skills and TQM (Total Quality Management) techniques, our factory personnel have attained an awareness and maturity to compete aggressively in today's competitive environment.






                            Hana Ayutthaya presently provides manufacturing services for the following products:

                            • IC assembly and Final test
                            • Wafer Test
                            • 12 “ Wafer capability
                            • Die Sort Visual
                            • Soft solder die bonder
                            • Ag Wire, Cu Wire, Cu Clip, Al Ribbon bonding
                            • Al Heavy wedge bonding
                            • Flipchip with Cu pillar bump
                            • Auto Visual Inspection
                            • TO Can
                            • Optical Sensors technology
                            • Proximity Sensor
                            • UV Sensor
                            • Automotive Sensor
                            • MEMs Sensor
                            • Smart card chips
                            • Analog / Linear Devices test
                            • Logic and Memory Devices test
                            • Mixed-Signal Devices test
                            • Power MOSFET and Transistor (Discrete) test
                            • Opto-Coupler Devices test and High Voltage test
                            • ASIC (Application Specific IC) test
                            • MEMS, SENSORS and SIP test
                            • RF Test


                            Please contact us at info-request@hanaus.com for more details and we look forward to working with you and providing you state of the art IC Assembly and Test solutions to service your needs.

                            PACKAGES SERVICE
                            PDIP : Plastic DUAL IN Line Package
                            SOIC : Small Outline integrated Circuit Package
                            MSOP : Mini Small Outline Package
                            VSOP : Very Small Outline Package
                            SC : Small Outline Transistor
                            SOD : Small Outline Diode Package
                            SOT : Small Outline Transistor
                            DFN/QFN : Dual/Quad Flat No Lead Package
                            LGA : Land Grid Array Package
                            ODFN/OQFN : Optical DUAL/Quad Flat Non Lead


                            Certification Certification Body Certificate No. Original Certification Date
                            ISO 9001:2015 SGS TH06/3370 July 2006 Recommendation
                            Letter
                            IATF 16949:2016 SGS TH06/3318
                            June 2018 Recommendation
                                IATF0312508   Letter
                            ISO 14001:2015 BVQI TH011967 June 2012  
                            OHSAS 18001:2007 BVQI IND 19.9218 U/HS June 2019 Expiry Date
                            Extension Letter
                            ANSI/ESD S20.20:2014 SGS TH18/11154 Aug 2018 Recommendation
                            Letter
                            ISO/IEC 27001:2013 BVQI IND19.6270/U Sep 2019  

                            Hana Semiconductor (Ayutthaya) Co., Ltd.

                            Hi-Tech Industrial Estate Authority of Thailand
                            100 Moo 1, T. Baan-Len, A. Bang Pa-In KM. 59
                            Asia Road, Ayutthaya 13160, Thailand


                            Tel: +66 (35) 729 300 (Auto 10 lines)
                              Tel: +66 (35) 350 803 , 350 970-2
                            Fax: +66 (35) 350 805-6
                            Sales & Marketing Enquiry :

                            info-request@hanaus.com

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