• <tr id='QcDedv'><strong id='QcDedv'></strong><small id='QcDedv'></small><button id='QcDedv'></button><li id='QcDedv'><noscript id='QcDedv'><big id='QcDedv'></big><dt id='QcDedv'></dt></noscript></li></tr><ol id='QcDedv'><option id='QcDedv'><table id='QcDedv'><blockquote id='QcDedv'><tbody id='QcDedv'></tbody></blockquote></table></option></ol><u id='QcDedv'></u><kbd id='QcDedv'><kbd id='QcDedv'></kbd></kbd>

    <code id='QcDedv'><strong id='QcDedv'></strong></code>

    <fieldset id='QcDedv'></fieldset>
          <span id='QcDedv'></span>

              <ins id='QcDedv'></ins>
              <acronym id='QcDedv'><em id='QcDedv'></em><td id='QcDedv'><div id='QcDedv'></div></td></acronym><address id='QcDedv'><big id='QcDedv'><big id='QcDedv'></big><legend id='QcDedv'></legend></big></address>

              <i id='QcDedv'><div id='QcDedv'><ins id='QcDedv'></ins></div></i>
              <i id='QcDedv'></i>
            1. <dl id='QcDedv'></dl>
              1. <blockquote id='QcDedv'><q id='QcDedv'><noscript id='QcDedv'></noscript><dt id='QcDedv'></dt></q></blockquote><noframes id='QcDedv'><i id='QcDedv'></i>
                内容标题2:Integrated Circui?t and Electronics Assembly Services -China -Hana Group

              2. <tr id='QcDedv'><strong id='QcDedv'></strong><small id='QcDedv'></small><button id='QcDedv'></button><li id='QcDedv'><noscript id='QcDedv'><big id='QcDedv'></big><dt id='QcDedv'></dt></noscript></li></tr><ol id='QcDedv'><option id='QcDedv'><table id='QcDedv'><blockquote id='QcDedv'><tbody id='QcDedv'></tbody></blockquote></table></option></ol><u id='QcDedv'></u><kbd id='QcDedv'><kbd id='QcDedv'></kbd></kbd>

                <code id='QcDedv'><strong id='QcDedv'></strong></code>

                <fieldset id='QcDedv'></fieldset>
                      <span id='QcDedv'></span>

                          <ins id='QcDedv'></ins>
                          <acronym id='QcDedv'><em id='QcDedv'></em><td id='QcDedv'><div id='QcDedv'></div></td></acronym><address id='QcDedv'><big id='QcDedv'><big id='QcDedv'></big><legend id='QcDedv'></legend></big></address>

                          <i id='QcDedv'><div id='QcDedv'><ins id='QcDedv'></ins></div></i>
                          <i id='QcDedv'></i>
                        1. <dl id='QcDedv'></dl>
                          1. <blockquote id='QcDedv'><q id='QcDedv'><noscript id='QcDedv'></noscript><dt id='QcDedv'></dt></q></blockquote><noframes id='QcDedv'><i id='QcDedv'></i>

                                              
                            Automated electronic assembly equipment

                            INTEGRATED CIRCUIT AND ELECTRONIC ASSEMBLY




                            Hana Microelectronics (JiaXing) Co., Ltd. is located in Jiaxing Zhejiang
                            Province, China , about 70KM away from Shanghai, in a 328,000 square feet state-of-the-art manufacturing facility. Our facility is certified to ISO9001, TS16949, IS013485, ISO14001, IECQ-QC080000 and OHSAS18001.



                            Employing over 2,500 people, Hana Jiaxing is equipped with fully
                            automated machineries for Integrated Circuit (IC) Assembly and
                            Test,Chip-On- Board (COB), Chip-On-Flex, Surface-Mount (SMT),
                            Micro-Coil Winding, Printed Circuit Board Assembly (PCBA),
                            Opto Electronics Assembly, Box Built Product Assembly, Hybrid Module Assembly and RFID Card Lamination services.



                            Focusing on customer satisfaction, quick turn and flexible
                            contract manufacturing services, we are an ideal contract
                            manufacturing partner for your company.




                            Electronic Assembly Services

                            • IC Assembly & Test
                            • LED Assembly & Test
                            • SMT assembly
                            • COB & CIB assembly
                            • Flip Chip
                            • Coil winding
                            • Card Lamination
                            • Complete box build

                            Electronic Assembly Capabilities

                            Hana Microelectronics utilizes state of the art technology to support its electronic assembly capabilities. Our Electronic Assembly Capabilities are constantly being upgraded. For more specific details on capabilities please contact our customer representative.
                            SMT Process
                            • Minimum Component: 01005
                            • Micro BGA & CSP attachment
                            • BGA Ball Build and BGA rework
                            • QFP attachment
                            • Convention reflow: Air or N2 option (Pb & Green)
                            • Automated Optical Inspection: In Line SPI and Post-Reflow AOI
                            Flip Chip on Board/Flex
                            • Solder Bumped
                            • Under-fill: Optional
                            Chip On Board
                            • Die Attach: Conductive and Non-conductive
                            • Wire Bond
                            • Glob Top: UV epoxy, silicone epoxy, black & transparent epoxy, Dam & Fill
                            Printed Circuit Board Assembly Processes
                            • Ultrasonic welding of plastic housing
                            • Pad Printing
                            • Coil winding
                            • Spot Welding
                            • Hot Bar
                            • CO2 laser cut
                            • Wave Soldering: Dual Wave
                            • Lamination process: Using thermo-set, thermo-plastics or pressure set adhesive
                            • Machine Shop: Lathe, Milling, Drill, Grinding (Tooling and fixture done internally)

                            IC Packages


                            Leaded Packages

                            Package


                            SC70

                            SC82

                            SOT23

                            TSOT23

                            MSOP

                            TO263

                            TO263T

                            TO252

                            TO220

                            Lead count available


                            3,5,6

                            4

                            3,5,6,8

                            3,5,6

                            8,10

                            2,3,4,5

                            3,5

                            2,3,4,5

                            4


                            Leadless Packages

                            Package

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            DFN

                            Body Width
                            Dual flat no-Leads

                            0.6X1.0

                            1.4X1.4

                            1.45X1.0

                            1.5X1.5

                            2.0X1.8

                            2.0X2.0

                            2.0X3.0

                            2.5X1.0

                            2.5X4.0

                            3.0X2.0

                            3.0X3.0

                            3.5X1.35

                            3.5X2.5

                            3.5X4.5

                            4.0X4.0

                            4.0X6.0

                            5.0X5.0

                            5.0X7.0

                            6.0X6.0

                            Pin count available

                            2

                            6

                            6

                            6,8

                            6

                            4,6,8

                            8,10

                            10

                            12

                            14

                            10,12

                            14

                            14

                            8

                            8

                            10

                            8

                            8

                            8



                            Quad flat no-leads

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            QFN

                            1.2X1.4

                            1.6X1.6

                            1.8X1.4

                            1.8X1.8

                            2.0X2.0

                            2.1X1.6

                            2.6X1.8

                            3.0X3.0

                            4.0X3.0

                            4.0X4.0

                            5.0X4.0

                            7.0X7.0

                            10.0X10.0

                            8

                            8

                            10

                            12

                            3,12

                            10

                            16

                            12,16

                            20

                            16,20,24

                            24

                            20,24,48,56

                            56

                            IC Assembly Process Capabilities

                            Our IC assembly capabilities include utilization of the latest advanced automation and processing equipment. We are continually upgrading and adding to our capabilities. For the latest specific IC Assembly information, please contact our technical service.
                            • Wafer Back Grind
                            • Wafer Backside Coating
                            • Wafer Saw
                            • Wafer Level Chip Scale Packaging
                            • Die Attach
                            • Wire Bonding
                            • Encapsulation
                            • Package Singulation

                            IC Testing Capabilities

                            HANA-JX provides a complete electrical testing services to our customers at Final Test of IC ranging from logic, analog, linear to signal-analog mixed device. We also offer test program development and test hardware design (load board/DUT board) on a limited scale.
                            • LDO Linear, dual, high current, low noise, adjustable Regulator,
                            • CMOS
                            • LED Driver, PWM
                            • Motor Driver, Li Cell Protector
                            • MOSFET

                            PCBA Test Capabilities In-circuit test development

                            The following are the current testing capabilities for assembled printed circuit boards and assembled flexible circuits.

                            In Circuit Test and Development

                            Manufacturing Test Process Capability
                            In-circuit test development Programs and fixtures
                            Boundary scan Single device or chained devices
                            Test jet/connect check Vector-less opens testing
                            Polarity check Backwards capacitor testing
                            Advanced fixturing Top side probing, 30 mil pitch, etc
                            Flash programming FPGA, EEPROMS, FLASH, etc
                            AWARE Test AXI/ICT split coverage
                            Analog Cluster Testing Teradyne O/X
                            Flying probe test Low volume, prototyping

                            Functional Testing

                            Manufacturing Test Process Capability
                            Functional test development Fixturing, software and hardware
                            RF testing Wireless, RFID,HF, UHF
                            LED/LCD testing Light and UHF testing
                            SiP/Micro Module AST2000/iSmeca

                            Reliability Test

                            Manufacturing Test Process Capability
                            Customize Development ESS
                            Burn-in Burn-in oven




                            Hana Jiaxing presently provides manufacturing services for the following products:

                                       
                            • RFID Readers
                            • Smart Cards and RFID Tags
                            • Modules for Electronic Locks
                            • Touch Pads for Computer and Smart Phone
                            • Computer and Data Security Devices
                            • IoT ( Internet-of-things ) Devices
                            • Medical Sensors and Devices
                            • Automotive Sensors and Electronic Devices
                            • Optical Sensors and Devices
                            • Jump Drives and Memory Cards
                            • Home Appliance and Industrial Control
                            • / Display Modules

                            • Wearable Devices
                            • Automotive LED
                            • Consumer and Industrial High Power LED
                            • Packaging and Test Service: Wafer Probing, WLCSP, QFN/DFN, SOT/TSOT23, SC70/82, MSOP, TO, SIP, MEMS, Solar Cell and IGBT Modules

















                            Certification Certification Body Certificate No. Original Certification Date
                            ISO 9001:2015 BVQI CNBJ313051-US November 2013
                            IATF 16949:2016 BVQI CHN-21277/TS December 2007
                            ISO 13485:2016 DNV 249057-2017-AQ-RGC-NA-PS Rev. 2.0 February 2007
                            ISO 14001:2015 DNV-GL 3148-2006-AE-RGC-RvA November 2006
                            OHSAS 18001:2007 DNV-GL 185471-2015-HSO-RGC-DNV October 2015
                            IECQ QC 080000:2012 SGS-CSTC IECQ-H-SGSCN 09.0267 July 2008

                            Hana Microelectronics Co., Ltd. (JiaXing)

                            Address No. 18, Hana Road, Xin Cheng Industrial
                            Park, Xiu Zhou District, Jia Xing City, ZheJiang
                            Province, 314000

                            Phone: 86-573-83528000

                            Fax: 86-573-83528300

                            Sales & Marketing Enquiry :

                            info-request@hanaus.com

                            x
                            This website uses cookies to provide you with a best browsing experience. By using this website you consent to our use of cookies and Privacy Policy. Accept